Impact Factor:8.897
DOI number:10.1007/s12274-021-3658-7
Journal:Nano Research
Indexed by:Journal paper
Document Type:J
Translation or Not:no
Included Journals:SCI
Links to published journals:https://link.springer.com/article/10.1007/s12274-021-3658-7
First Author:Susu Yang
Correspondence Author:Mingsheng Xu,Bo Sun,Xinqiang Wang
All the Authors:Houfu Song3,Yan Peng,Lu Zhao,Yuzhen Tong,Feiyu Kang
Date of Publication:2021-07-08
王新强
+
Gender: Male
Alma Mater: 吉林大学
Paper Publications
Reduced thermal boundary conductance in GaN-based electronic devices introduced by metal bonding layer
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